Details about the upcoming Galaxy S25 FE have started to emerge earlier than anticipated, despite the smartphone’s launch being scheduled for the end of next year and Samsung recently releasing the Galaxy S24 FE. An interesting revelation is the potential inclusion of a MediaTek chip in the new model.
Samsung and MediaTek initially discussed using Dimensity chips in the main Galaxy models, but the focus has now shifted to preparing a Dimensity chip for the Galaxy S25 FE.
The Dimensity 9400, MediaTek’s most advanced chip at the moment, could be the model Samsung is considering to provide a cost-effective option with high performance.
The Dimensity 9400 is expected to provide a performance similar to the Snapdragon 8 Elite, allowing Galaxy S25 FE users to experience top-tier performance at a more affordable price.
Expectations for the Galaxy S25 FE
Samsung is expected to opt for the Dimensity 9400 chip for the Galaxy S25 FE, which features a unique combination of CPU cores and promises enhanced battery life due to its 3nm manufacturing process by TSMC.
The Galaxy S25 FE is anticipated to feature a 6.7-inch screen like the Galaxy S24 FE, with a sleeker design, triple camera setup, and pre-installed Android 15, following a similar upgrade plan as its predecessor.
Source:Original
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